Products & Services > Digital Video Microscopy
DIMIC™ LT
Laser Topography Digital Video Microscope
A new platform for high quality surface analysis
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Concept
This system is enhanced with state of the art laser technology to allow a high quality topography to be scanned from a micro object. The hybrid technologe has been enhanced with a variety of powerful and useful analytical capabilities. The capabilities make a DIMIC LT an irreplaceable tool for scientists, as well as for engineers. The creation of a high accurate virtual model of the object's surface allows insight into the nature of the object which goes way beyond conventional microscopy inspection. The 3D model is generated in two steps. In the first step a laser scaner acquires an accurate 3D topography. In the second step, high resolution images are mapped and fitted on the topography. Proprietary illumination and enhancement technicues are used for finalization.
High quality cameras
A key factor in the construction of a 3D topography is the camera. We use High Quality Camera's with UXGA resolution - 1/1.8" progressive scan Bayer mosaic colour sensor. The sensor has an array of 1624 (h) x 1232 (v) 4.4 µm square pixels. The camera has built in RGB filters for best available color retrieving.
Acquisition Formats.
Full Frame - 1624 x 1232 pixels x max. 16.0 fps.
Pixel Formats - Mono8, BayerRG8, BayerRG12, RGB8 Packed, BGR8 Packed, YUV411 Packed, YUV422 Packed, YUV444 Packed.
Image Pre-processing
Analog Controls - Gain (0 ... 20 dB), Offset (0 ... 255 LSB | 12 bit)
Color Models - RGB, YUV, Mono
Color Processing - Integrated color processor for high quality color calculation
Color Adjustment - One Push White Balance, User-speci?c color adjustment
Homoginius Illumination
Special illumination technology can be provided comlimentary to enhance the vision system's performance. For reflective samples it provides unique diffuse and homogeneous light.
Precise laser
Smart combination of light source, laser system and accurate mechanical position unit allows obtain unique structured mixtures of height and color information.
Line width - 30 µm or less;
Wavelength - 658 nm;
Power - 25 W/m2
3D enchanced Lens
A High resolution Megapixel lens are used to enhance quality of images from micron size objects to better determine their 2D and 3D nature. The combination of large zoom range 0.007-7000x (0.8 micron resolution), with large field of view, allows to reach a large dynamic magnification for a wide range of applications.
High precision positioning system
The sample is mounted on a precise positioning system. A computer with software offers complete digital control of any XYZ movement with steps of 0.22 µm accuracy. USB 2.0 Plug & Play motors are used to generate high level of micro stepping (any micro step value from 2 to 500) and pulse rate support (800 Kbps).
Scan system
Travel range - 15 cm;
Coefficient of friction - 0.09 typical;
Coefficient range - 0.04;
Repeatability (whole range) - 5 microns;
Straight line accuracy - 8 microns over entire travel distance;
Screw lead accuracy - 0.076 mm/25 cm.
XY Positioning
XY Table provides exceptional rigidity;
dual, parallel bearing design for outstanding support of cantilevered loads, and a large work surface area.
Microobjects 3D modeling
DIMIC™ LT uses a motorized axis to acquire area scans. A laser diode (line width - 30 µm) illuminates the profile on the sample. Collection of profiles creates 3D surface model. The camera acquires images which are mapped on the 3D profile. Proprietary image analysis algorithms assurea smooth and flawless merging of all images into a true color 3D display.
The 3D measurement functions allow the user to obtain an accurate and detailed profile of any target. For user convenience these profiles can be visualized in many different ways.
2D & 3D measurements
The 3D topography evaluation features of the DIMIC LT system additionally allow to measure any kind of 2D geometrical feature, using Point, Line, Polygon and Circle and other tools. It allows to performing measurements: between two points; consecutive line; perpendicular line; circle; between parallel lines; angle; polygon perimeter and area; XY coordinates of the objects; 3D profiles; colour profiles; etc. The profile features are convenient for quality control inspection. Profile can be obtained from any kind of measurement. All measurements and calculations can be exported as pictures or as standard MsOffice files for further processing. For reversed engineering applications we provide tools to convert coordinates into Solid Works drawings.
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| Distance between two points | Angle connecting 3 designated points | Angle connecting 4 designated points | Point coordinates | Polygoline | Parallel distance | Straight Line | Polygon |
Particles/defects analysis
Furthermore, the software allows mofometric features to be calculated of the object’s particles/defects.
Elongation - locates the centre of gravity, builds the longest axis in the particle and the axis orthogonal through the centre. The value of elongation is 100% minus the relation between the longest and the orthogonal axis. The elongation of a circle is 0, all other forms are >0 and <100%.
Roundness - locates the centre of gravity and builds the biggest inner and the smallest outer circle around it. The value of roundness is the relation between the inner and the outer circle. The roundness of a circle is 100%, all other forms <100%.
Compactness - is calculated as the relation between the objects area and its perimeter ([4*Π*S]/Π2). A perfect circle has a compactness of 100%.
Roughness - is the relation of the areas which can be built by circuits of 80% of sieve diameter and the built area. It is a characteristic number for all domes sticked out of a particle.
Convexity - builds a rubber band around the particle and determines the inner area. The value of convexity is the relation between the area of the particle and the built rubber band area. It is a characteristic number for all indentations of a particle.
And much more...
SYSTEM CONFIGURATION
DIMIC LT console consist of SAMPLE CHAMBER for admittance of sample:
Dimensions, mm - 482 (W) x 415 (H) x 450 (D);
Power supply, V - 110-220 AC.
With integrated components:
CONTROL UNIT
- USB 2.0 connection;
- Power supply 12V;
- Light source, laser and positioning system digital control.
DIGITAL CAMERA
- 2 MPix CCD 1/1.8” progressive scan Bayer mosaic colour sensor;
- FPS - 25 fps;
- Resolution: 1624 (h) x 1236 (v) 4.4 µm square pixels;
- GigE protocol.
LENS
- High quality zoom lens with set of different objectives.
LASER
- Line width - 30 µm;
- Wavelength - 658 nm;
- Power - 25 W/m2.
FLEXIBLE POSITIONING SYSTEM
- Motorized adjustable stand;
- XY table.
ILLUMINATION
- LED light source 5 W;
- Colour Temperature 6000K;
- 250 Lm.
OPERATION BLOCK - Laptop or integrated PC versions available.
We always use top-line modern components to insure best perfomanse.
- Processor Intel® Core™ i7 family;
- Hard drive Serial ATA II 500 Gb 7200 rpm 32 Mb;
- Memory DDR3 2 Gb 1600 MHz;
- Video-card PCI-Ex GeForce 9800 GT 1024MB DDR3;
- 2x 10/100/1000 GIGABIT DESKTOP PCI ADAPTER.
MICRO-OPTIK TOPOGRAPHY ANALYSIS SOFTWARE - With morphometric analysis.
- Measurements functions (distances, areas, angles).
- Images optimizations and mathematical morphology functions.
- Images calculations - adding, subtractions, division, multiplying.
- Logical operations on images. Integrated analysis of the formulas.
- Identification of the particles/defects and calculation the detailed shape and size information (Perimeter, Area, Roundness, Elongation, Compactness, Convexity).
- Different charts and distribution plots.
- 3D topography scan functions.
- Different 3D visualizations and adjustments.
- Unique 3D colored and textured modeling.
- Height measurement fucntions and 3D models generation.
- Export the data to different standard formats.
- Special functions and adjustments possible on demand.